| 1. | The process of copper metallizing of carbon powder was investigated . the hydrophilicity , sensitization , activation and reduction were also studied . the copper deposit could be made thicker by electromagnetic agitation 摘要研究了在碳粉表面电镀铜的工艺。首先对碳粉表面进行亲水、敏化、活化和还原处理,然后在其表面化学镀铜,形成导电膜,再采用电磁搅拌的方法电镀铜,使镀层加厚。 |